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IPO Detail
08637 元續科技
METASURFACE
Listing Date2024/07/02    Listing in 4 Days
Listing Price2.420
Grey Market Performance
Last updated: 28/06/2024 17:25  Refresh
  • Bright Smart
    down 1.820 -0.600 (-24.793%)
    High
    2.990
     
    Low
    1.740
    Volume
    322,000
    One Lot Profit
    -600.00
  • Phillip
    down 1.810 -0.610 (-25.207%)
    High
    2.590
     
    Low
    1.700
    Volume
    4,600,000
    One Lot Profit
    -610.00
  • Futu
    unchange -- -- (--)
     
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  • Bid
  • Ask
  • 1.770
  • (1) 5K
  • 4K (1)
  • 1.850
  • 1.760
  • (1) 5K
  • 0 (0)
  • 1.860
  • 1.750
  • (0) 0
  • 5K (1)
  • 1.870
  • 1.740
  • (0) 0
  • 4K (1)
  • 1.880
  • 1.730
  • (1) 1K
  • 0 (0)
  • 1.890
  • 1.720
  • (0) 0
  • 2K (1)
  • 1.900
  • 1.710
  • (2) 9K
  • 0 (0)
  • 1.910
  • 1.700
  • (0) 0
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  • 1.920
  • 1.690
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  • 1.930
  • 1.680
  • (0) 0
  • 0 (0)
  • 1.940
  • Bid
  • Ask
  • 1.810
  • (2) 8K
  • 5K (2)
  • 1.820
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  • (6) 28K
  • 6K (2)
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  • (6) 29K
  • 6K (3)
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  • (5) 16K
  • 11K (2)
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  • (5) 5K
  • 10K (4)
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COMPANY PROFILE

Metasurface Technologies Holdings was established in 2000, the Group is a precision engineering services provider headquartered in Singapore, specialising in providing precision machining and precision welding services for international companies in the semiconductor and other sectors.

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Precision machining involves using Computer Numerical Controls (‘‘CNC’’) machines and other advanced machine tools to cut and shape materials and to produce parts that meet extremely strict specifications in terms of size, shape, surface finish and other geometric attributes with micrometre-level of accuracy. Precision welding involves using advanced welding methods and specialised processes such as laser and electron beam to join materials together according to strict specifications and tolerance. The Group has grown business to serve customers in various sectors, including semiconductor, aerospace and data storage industries.

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According to report, the Group ranked fifth in terms of revenue from the semiconductor segment of the precision component engineering industry in Singapore in 2023 with a market share of 3.3%.

The Group’s business is headquartered in Singapore with production facilities in Singapore and Malaysia.

BASIC INFORMATION
MarketHong Kong (GEM)
Business NatureIndustrials
Major Business AreaSingapore
Board Lot1000
GLOBAL OFFERING
No. of Offer Shares27.00M shares
No. of Public Offer Shares2.70M shares
No. of Placing Shares24.30M shares
Offer Price$2.38 - $3.00
Stock Code8637
Sponsor(s)UOB Kay Hian (Hong Kong) Limited
Underwriter(s)UOB Kay Hian (Hong Kong) Limited, Chiyu International Capital Limited, Cinda International Capital Limited, Maxa Capital Limited, Tiger Brokers (HK) Global Limited
TIME TABLE
Application PeriodJun 21 (Fri) - noon, Jun 26 (Wed)
Price Determination DateJun 27 (Thu)
Result Announcement DateOn or before Jun 28 (Fri)
Result Announcement DateOn or before Jun 28 (Fri)
Result Announcement DateOn or before Jul 02 (Tue)
Dealings in Shares commence onJul 02, 2024. (Tue)
Reallocation of Shares Offered
Times of HK Offer Shares Subscription15X - 50X50X - 100XOver 100X
% of total shares reallocated to HK Offer30%40%50%
Sales Statistics (HKD)
Offer Price$2.38 - $3.00
Capitalization357.00M - 450.00M
NAV / share ($)$1.08 - $1.19 (Unaudited pro forma adj NAV / share)
Use Of Proceeds
Assuming the offer price being at HKD 2.69, the net proceeds raised would be HKD 20.60M, of which
60.1% : Expanding scale of operation and enhancing production capabilities
15.4% : Strengthening quality control capabilities include acquisition of new coordinate measuring machine and enhancing information system
4.7% : Enhancing marketing efforts
9.8% : Repayment of certain bank borrowings
10% : working capital
IPO NEWS
28/06/2024 16:20
{New Stock}METASURFACE down 24.38% at HK$1.83 on grey market
Related Document
Prospectus Prospectus  Chinese VersionProspectus  English Version
Remark： The above information is referenced from the prospectus.
  All data is calculated from the non- exercise rights(if applicable).
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